باد سيليكون مغناطيسي 2UUL BH15 MagGrid (لتنظيم المسامير وشبلنة الآيسيات)

2UUL BH15 MagGrid Magnetic Silicone Pad for Mobile Phone CPU Nand Flash IC BGA Chip Stencils Repair Reballing Soldering MatDescription2UUL BH15 MagGrid Pad Chip Silicone Buffer Soldering Pad for Mobile Phone CPU Nand Flash IC BGA Chip Welding Repair. 2UUL BH15 MagGrid Magnetic Silicone Pad with 0.3mm 0.4mm 0.5mm 0.8mm chip slot, suitable for various Phone CPU Nand chip and BGA chip soldering, reballing, and repair. Product Parameters:Name: 2UUL BH15 MagGrid Pad Chip Silicone Buffer Soldering PadNet Weight: 65.5gProduct Size: 104mmx80mmx8mmPackage Size: 130mmx84mmx11mmGross Weight: 78.5gFeatures:1. Rubber magnetic tin planting pad, soft silicone material, strong magnetic adsorption, high temperature resistance, easy to clean.2. Curved design, strong magnetic adsorption, seamless fitness, hands-free.3. Makes the tin planting net BGA stencil not easy to fall off and shift, making the chip tin planting more firm and stable.4. Planting hole heat dissipation roller, hollow heat dissipation hole design on the back of the planting pot net, the planting pot has good heat dissipation effect, and the steel net planting pot will not bulge5. High temperature resistant,soft silicone, elastic cushioning, can withstand high temperatures up to 500℃.