Core Advantages:1.High Conductivity and Solder ReliabilityHigh solder joint reliability and outstanding thermal fatigue resistance make it particularly suitable for the high-frequency signal transmission requirements of precision circuits such as mobile phone motherboards.2.Large-Capacity Standardized PackagingEach bottle contains 100,000 solder balls, meeting the needs of large-volume professional repair scenarios.3.Multi-Scenario CompatibilityDevice Compatibility: Covers major mobile phone brands such as iPhone and Android, and adapts to the solder pad repair needs of different motherboard models.Process Compatibility: Supports various processes such as BGA ball placement, IC chip soldering, and PCB pad repair.Core Applications：1.Mobile Phone Motherboard RepairBGA Reballing: Repairs solder balls on BGA chips (such as CPUs and baseband chips) that have fallen off due to drops or overheating, restoring the electrical connection between the chip and the motherboard.Pad Repair: Rebuilds solder joints on motherboards where solder pads are missing due to corrosion, short circuits, or mechanical damage, extending the life of the motherboard.2.IC Chip RepairChip Soldering and Replacement: Suitable for precision work on fine-pitch pins below 0.5mm.Reballing: Re-balls BGA/CSP packaged chips, adapting to different ball diameters (e.g., 0.3mm-1.0mm), supporting chip-level refurbishment.
