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هولدر XZZ S2 الدوار (مقاس وسط)

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Description

XZZ S1 Mini rotary CPU chip soldering fixture suitable for microsocpe base. XZZ S2/S3 motherboard chip repair fixture for mobile phone PCB CPU Nand WIFI BGA chip soldering repair. XinZhiZao S1 Mini/S2/S3 PCB holder fixture with high temperature resistant synthetic stone for motherboard chips repair.XZZ S1 fixture parameters:Model: XZZ S1Net weight: 220gGross weight: 232gProduct size: 114*54*27MMPackaging size: 115*56*28MMName: Motherboard chip repair rotating fixtureMaterial: imported synthetic stone, aviation aluminumScope of application: Fixing motherboards, suitable for CPUs of different shapes, hard disks, and other precision ICs that need to be debonded.XZZ S2 Fixture Parameters:Model: XZZ S2Name: Motherboard chip repair fixtureNet weight: 203gGross weight: 214gProduct size: 117*65*21MMPackaging size: 120*67*23MMMaterial: imported synthetic stone, aviation aluminumScope of application: Fixing motherboards, suitable for CPUs of different shapes, hard disks, and other precision ICs that need to be debonded.XZZ S3 fixture parameters:Model: XZZ S3Net weight: 297gGross weight: 311gProduct size: 185*61*22MMPackaging size: 187*63*23MMName: Motherboard chip repair jigMaterial: imported synthetic stone, aviation aluminumScope of application: Fixing motherboards, suitable for CPUs of different shapes, hard disks, and other precision ICs that need to be debonded.