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هولدر شبلنة معالجات الأيفون RELIFE RL-601MA (من A11 إلى A19 Pro)

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Description

RELIFE RL-601MA A11-A19 Pro CPU Planting Tin Platform Set for Mobile Phone Logic Board BGA Solder Ball Repair Base StencilRELIFE RL-601MA CPU Repair Fixture Set/IP Series (A11-A19 Pro):.Using a new type of magnetic power original positioning, strong magnetic automatic clamping, convenient and flexible, support for a variety of CPU maintenance positioning, stable and reliable clamping .Built-in high temperature magnet, strong magnetic adsorption, precise positioning, no offset, high temperature magnetic unchanged .High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls