i2C T18 PCB motherboard layered desoldering station with HD screen display For iPhone X-16 Pro Max. i2C T18 PCB desoldering station supports X-16PM motherboard separation/Chip CPU glue removal degumming/lamination/delamination/desoldering and soldering repair.Package Option:Package A: i2C T18 host + Universal module.Package B: i2C T18 host + Glue removal module.Package C: i2C T18 host + X-15 series (4pcs modules).Package D: i2C T18 host + Universal module + Glue removal module + X-15 series (6pcs modules).Package E: i2C T18 host + X-16 series (5pcs modules).Features:1. T18 PCB motherboard desoldering station, magnetic modular design, constant temperature desoldering, and explosion-tin proof.2. LCD HD screen display, 2Gears of temp adjustment, Supports iPhone X to 16Pro Max motherboard separation, chip CPU glue removal, and other functions.3. Aviation aluminum material, CNC precision processing, high-temperature resistance, and oxidation resistance.4. Rapid heating, matched with PTC ceramic heating pieces, it can heat up to 180°C in 60 seconds rapidly.5. Module strong magnetic automatic adsorption, module replacement as you wish, simple and more convenient.6. Put the chip on and switch to 245℃, then use a brush to remove the glue and tin residue on the chip, it can be adapted to 98%of the chips and can meet the needs of 98%of IC glue removal and desoldering on the market.7. Only one host can support multiple modules, support Apple and Android double-layer motherboard layering, fit, and repair, and can also be applied to the repair of various precision electronic and digital products.Specification:Brand: i2C.Model: T18.Name: T18 PCB motherboard desoldering station.Supply voltage: AC 110V~220V.Minimum temperature: 180°C.Display: LED digital display.Maximum temperature: 245℃.Body size: 134*116*17mm.Scope of use: Motherboard separation and bonding.Packing size: 214*143*80mm.
